"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages"
This section includes a questionnaire concerning the renewal of an ELV Exemption. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.
(Reviewed as Exemption No. 8a, Stakeholder Proposal Part C(v))
Additional Information relevant for this exemption:
>> ELV Exemption Request 15 reviewed in 2009