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Exemption 8(h)

"Lead in solder to attach heat spreaders to the heat sink in power semiconductor assemblies with a chip size of at least 1 cm 2 of projection area and a nominal current density of at least 1 A/mm 2 of silicon chip area"

This section includes a questionnaire concerning the renewal of an ELV Exemption. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.

Background documents

> Original exemption review report

(Reviewed as Exemption No. 8a, Stakeholder Proposal Part C(iv))

Contribution to the consultation

> Contribution by the automotive industry associations ACEA, CLEPA, JAMA, KAMA  et al. submitted 04 November 2013

>> General contribution

>> Exemption 8(h) specific contribution