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Exemption 8(g)

"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages"


This section includes a questionnaire concerning the renewal of an ELV Exemption. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.


> Excerpt from 2015 exemption review report

> Link to previous consultations



> Specific questions for Exemption 8(g) (PDF)