Exemption 8(g)

"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages"

 

This section includes a questionnaire concerning the renewal of an ELV Exemption. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.

 

> Excerpt from 2015 exemption review report

> Link to previous consultations

 

Questionnaire

> Specific questions for Exemption 8(g) (PDF)

 

Contributions to the consultation

> Contribution by the automotive industry association ACEA, CLEPA, JAMA, KAMA  et al., submitted 24 July 2018

>> General Document

>> Exemption 8(g) specific contribution