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Exemption 8(g)

"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages"

This section includes a questionnaire concerning the renewal of an ELV Exemption. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.

Background documents

> Original exemption review report

(Reviewed as Exemption No. 8a, Stakeholder Proposal Part C(v))

Additional Information relevant for this exemption:

>> ELV Exemption Request 15 reviewed in 2009

Contribution to the consultation

> Contribution by the automotive industry associations ACEA, CLEPA, JAMA, KAMA  et al. submitted 04 November 2013

>> General contribution

>> Exemption 8(g) specific contribution