Exemption 8(g)
"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages"
This section includes a questionnaire concerning the renewal of an ELV Exemption. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.
Background documents
> Original exemption review report
(Reviewed as Exemption No. 8a, Stakeholder Proposal Part C(v))
Additional Information relevant for this exemption:
>> ELV Exemption Request 15 reviewed in 2009
Questionnaire
Contribution to the consultation
> Contribution by the automotive industry associations ACEA, CLEPA, JAMA, KAMA et al. submitted 04 November 2013