Exemption 8(h)
"Lead in solder to attach heat spreaders to the heat sink in power semiconductor assemblies with a chip size of at least 1 cm 2 of projection area and a nominal current density of at least 1 A/mm 2 of silicon chip area"
This section includes a questionnaire concerning the renewal of an ELV Exemption. Stakeholders are requested to base their submissions on this questionnaire including as much comprehensive information as possible.
Background documents
> Original exemption review report
(Reviewed as Exemption No. 8a, Stakeholder Proposal Part C(iv))
Questionnaire
Contribution to the consultation
> Contribution by the automotive industry associations ACEA, CLEPA, JAMA, KAMA et al. submitted 04 November 2013